Thickness 0.15mm 0.25mm 0.5mm AIN Aluminum Nitride Substrate

Brand Name
3X Ceramic Parts
Material Type
Aluminum Nitride Ceramic
Forming Way
Tape casting
MOQ
5 pcs
Specification
custom make
Shape
custom made
Density
3.33g/cm3
Surface finish
polished or not
Main Property
high thermal conductivity
Thermal Conductivity
≥170W/(m.k)
Thermal Shock Resistant
good
Flexural Strength
>400 Mpa
Tolerance
0.001mm
Delivery Time
25 days around
Shipping Way
by express

Thickness 0.15mm 0.25mm 0.5mm  Aluminum Nitride Substrate 

The Advantage of Aluminum Nitride Substrate : 

3X Ceramic Parts company use tape casting to produce high thermal conductivity aluminum nitride substrates .  

* High Thermal Conductivity ≥170 W/ m.k 

* Meet Variesties of metallization applications :  DPC , DBC , TPC , AMB , thick film printing . 

*  Quality control from source . 

* Thinner Thickness products :   Thickness like 0.15mm , 0.25mm, 0.5mm, 1mm , 2mm

The Classification of AIN substrate : 

AIN substrate  As Fired Type         
Grinding Type 
Scribing Type 
Polishing Type 

Regurly used specification of AIN Ceramic Substrate : 

  Thickness (mm)                                                                    Substrate Size ( mm )                                       
50.8x50.8 (2"x2") 101.6x101.6 (4"x4‘’) 114.3x114.3 (4.5"x4.5")   120x120  127x127  ( 5"x5")   139.7x190.5 (5.5"x7.5") 152.4x152.4 (6"x6") 203.2x203.2 (8“x8”) 304.8x304.8 (12"x12" ) 
0.25  ※ - - - - - -
0.38 ※ * P ※ * P ※*P ※*P ※*P - - - -
0.50 ※* P ※*P ※*P ※*P ※*P ※* ※* ※* -
0.635 ※*P ※*P ※*P ※*P ※*P ※* ※* ※* -
1.0 ※*P ※*P ※*P ※*P ※*P ※* ※* ※* ※*
1.5 ※*P ※*P ※*P ※*P ※*P ※* ※* ※* ※*
2.0 ※*P ※*P ※*P ※*P ※*P ※* ※* ※* ※*

※ : Lapped type                                   *: As- Fired Type                                   P : Polished Type

Properties Sheet of AIN substrate : 

Subject Unit Value
Density g/cm3 3.33
Water Absoption Rate % 0
Surface finish μm 0.3-0.7
Heat Conductivity W/(m・k) >170
Flexural Strength Mpa >400
Waviness Length% 2%
Dielectric Constant 1MHZ 8.8
Dielectric Loss 1MHZ 10-4 3
Breakdown strength KV/mm 17
Heat Expansion Coefficient 6-10/℃(25-100℃) 4.5

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