Laser cutting Ceramic Substrate Capability
Date: | Read: 5002
We are equipped with Ceramic Laser Cutting Machine , the ability ase as follows .
1.Laser cutting Ceramic Substrates thickness less than 2.0mm
2.Laser cutting hole diameter as small as 0.05mm .
3.Ceramic Substrate Length & width as large as 360mm
Laser Cutting , drilling holes Alumina Ceramic Substrate :
Laser Scribing Alumina Ceramic Substrate :
