Laser cutting Ceramic Substrate Capability

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We are equipped with Ceramic Laser Cutting Machine ,  the  ability ase as follows .

1.Laser cutting Ceramic Substrates thickness less than 2.0mm

2.Laser cutting hole diameter as small as 0.05mm .

3.Ceramic Substrate Length & width as large as 360mm

Laser cutting Ceramic Substrate Capability

 

 Laser Cutting , drilling holes Alumina Ceramic Substrate : 

Laser cutting Ceramic Substrate Capability

Laser Scribing Alumina Ceramic Substrate : 

Laser cutting Ceramic Substrate Capability

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