Zirconia Ceramic Substrate Properties:
The zirconia ceramic substrate, is a sheet-like material which forms a supporting base for the film circuit component and the externally-applied component on the basis of the electronic ceramic. Zirocnia Ceramic substrates have high temperature resistance, high electrical insulation properties, low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficients of components.According to the application field of ceramic substrate, it is divided into HIC (hybrid integrated circuit) ceramic substrate, focusing potentiometer ceramic substrate, laser heating fixing ceramic substrate, chip resistor substrate, network resistor substrate, etc.; Different ways, zirconia ceramic substrates are divided into two types: molded tablets and laser scribe films.Ceramic substrate materials include, ZrO2, Al2O3, AlN, SiC, BeO, BN, mullite, and glass ceramics.
According to different application fields, zirconia ceramic substrate can be divided into HIC ceramic substrate, focusing potentiometer ceramic substrate, laser heating and fixing ceramic chip, chip resistor, network resistor, etc.; according to the different processing methods, ceramic chip can be divided into two categories: die-casting sheet and laser scribing sheet.
Traditional Processing Way of Zirconia Ceramic Substrate:
The traditional processing method uses a high-precision ceramic engraving and milling machine. First, the crushed powder is mixed with binder, plasticizer, dispersant and solvent to make slurry with a certain viscosity. The slurry flows down from the hopper and is applied on the special base plate with a certain thickness of scraper. After drying and curing, the film is peeled off from the top to form a green belt,
Then, according to the size and shape of the finished products, the green strips need to be processed by punching, laminating and so on. The products have the main advantages of high temperature resistance, high electrical insulation, low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and close to the thermal expansion coefficient of components. The equipment required for the process includes grinder, engraving machine, printing machine, static press, sintering furnace, etc.