Silicon Nitride Breaking Segment
- Brand Name
- 3X Ceramic Parts
- Material Type
- Silicon Nitride
- MOQ
- 5 pieces
- Specification
- H 6.65 * L 140 mm
- Color
- black
- Hardness
- 16 Gpa
- Density
- 3.28g /cm3
- Main Property
- good thermal shock resistance
- Max working temperature
- 1150 ℃
- Thermal Conductivity
- 25 W /（m.k）
- Thermal Shock Resistant
- Good
- Delivery Time
- 25 days around
- Shipping Way
- by express
- PACKAGE
- safety packing
Silicon Nitride Breaking Segment
Characteristics of Silicon Nitride Breaking Segment :
- High strength over a broad temperature range
-Moderate thermal conductivity
-Low coefficient of thermal expansion
-Moderately high elastic modulus
-Excellent thermal shock resistance
-Ability to withstand high structural loads to high temperature
-Superior wear resistance
Unusually high fracture toughness
Properties Sheet of Silicon Nitride Ceramics :
|
Property |
SSN |
GPS-SSN |
HPSN |
RBSN |
|
Density (g.cm-3) |
3.28 |
3.30 |
3.23 |
2.5 |
|
Young's Modulus (GPa) |
285 |
320 |
315 |
189 |
|
Bend Strength (MPa) |
675 |
750 |
850 |
440 |
|
Fracture Toughness K1c (MPa.m0.5) |
6 |
7 |
8 |
2.5 |
|
Hardness (GPa) |
16 |
16 |
16 |
7.2 |
|
Thermal Expansion Coefficient (x 10-6/°C) |
3.2 |
3.2 |
3.2 |
3.2 |
|
Thermal Conductivity (W/m.K) |
25 |
30 |
30 |
14 |
|
Maximum Temperature (°C) for application |
1150 |
1150 |
1150 |
1100 |
|
Dielectric Constant |
9 |
9 |
9 |
7.5 |
|
Abrasive Wear resistance Parameter |
1110 |
1130 |
1120 |
360 |
