Zirconia Ceramic Wafer Support Loader

Brand Name
3X Ceramic Parts
Material Type
zirconia ceramic
Forming Way
isostatic pressing
1 piece
custom make
Surface finish
Main Property
corrosion resistance
Machining Way
cnc machining
Max working temperature
1500 ℃
Thermal Conductivity
2 W/m.k
Thermal Shock Resistant
350 ℃
Compressive Strength
2500 Mpa
Flexural Strength
1200 Mpa

High Precision Zirconia Ceramic Wafer  Support Loader 

Zirconia Ceramic Wafer Carrier Support is highly precision machinind by flapping machine and CNC machined . It is used on the photovaltaic equipment machine to carry the wafer in semiconductor industry . 

Zirconia ceramic wafer carrier  has the characteristics of high temperature resistance, corrosion resistance, wear resistance, high precision, high strength and high cost performance. It is widely used in various fields. The processing methods of zirconia ceramic wafer carrier  of inserting machine mainly include grinder grinding and ceramic CNC precision carving. The first is to use the surface grinder to process the shape of zirconia rough embryo. This process can process the complete tooth shape, groove, etc. after grinding by the grinder, the zirconia ceramic wafer support now has a high-precision overall dimension. After finishing this process, it will be transferred to the ceramic CNC machine tool for back-end processing. CNC is mainly used to process the holes on the ceramic top teeth. Here, the problem of ceramic perforation edge collapse should be controlled. If you are careful, the edge will collapse, but it is difficult to recover the edge collapse.

At this time, we can adopt the method of drilling a small hole first and then expanding the hole. Similarly, we can reserve more thickness of the zirconia wafer support first, and then go to the grinder to smooth the broken side after machining the hole. At this time, we can achieve the effect of removing the broken edge.

Online Inquiry